In-package microelectronic apparatus, and methods of using same

ABSTRACT

A mounting substrate for a processor includes a die side and a land side with a processor footprint configured on the die side. The processor footprint is coupled to at least one processor interconnect and a microelectronic die is embedded in the mounting substrate. The microelectronic die is coupled to the processor interconnect and communication between a processor to be installed on the processor footprint is in a rate between 10 Gb/s and 1 Tb/s.

TECHNICAL FIELD

Disclosed embodiments relate to semiconductor microelectronic devicesand processes of packaging them.

BRIEF DESCRIPTION OF THE DRAWINGS

In order to understand the manner in which embodiments are obtained, amore particular description of various embodiments briefly describedabove will be rendered by reference to the appended drawings. Thesedrawings depict embodiments that are not necessarily drawn to scale andare not to be considered to be limiting in scope. Some embodiments willbe described and explained with additional specificity and detailthrough the use of the accompanying drawings in which:

FIG. 1 a is a cross-section elevation of a mounting substrate for aprocessor with an embedded microelectronic die according to an exampleembodiment;

FIG. 1 b is a cross-section elevation of the mounting substrate for aprocessor depicted in FIG. 1 a after further processing according to anexample embodiment;

FIG. 2 is a cross-section elevation of an apparatus including a mountingsubstrate for a processor with an embedded microelectronic die accordingto an example embodiment;

FIG. 3 is a cross-section elevation of an apparatus including a mountingsubstrate for a processor with an embedded microelectronic die accordingto an example embodiment;

FIG. 4 is a cross-section elevation of an apparatus including a mountingsubstrate for a processor with an embedded microelectronic die accordingto an example embodiment;

FIG. 5 is a cross-section elevation of an apparatus including a mountingsubstrate for a processor with an embedded microelectronic die accordingto an example embodiment;

FIG. 6 is a cross-section elevation of an apparatus including a mountingsubstrate for a processor with an embedded microelectronic die accordingto an example embodiment;

FIG. 7 is a process flow diagram according to an example embodiment; and

FIG. 8 is a schematic of an electronic system according to anembodiment.

DETAILED DESCRIPTION

Reference will now be made to the drawings wherein like structures maybe provided with like suffix reference designations. In order to showthe structures of various embodiments most clearly, the drawingsincluded herein are diagrammatic representations of integrated circuitstructures. Thus, the actual appearance of the fabricated structures,for example in a photomicrograph, may appear different while stillincorporating the claimed structures of the illustrated embodiments.Moreover, the drawings may only show the structures necessary tounderstand the illustrated embodiments. Additional structures known inthe art may not have been included to maintain the clarity of thedrawings. Although a processor chip and a memory chip may be mentionedin the same sentence, it should not be construed that they areequivalent structures.

Reference throughout this disclosure to “one embodiment” or “anembodiment” means that a particular feature, structure, orcharacteristic described in connection with which the embodiment isincluded in at least one embodiment of the present invention. Theappearance of the phrases “in one embodiment” or “in an embodiment” invarious places throughout this disclosure are not necessarily allreferring to the same embodiment. Furthermore, the particular features,structures, or characteristics may be combined in any suitable manner inone or more embodiments.

Terms such as “upper” and “lower” may be understood by reference to theX-Z or Y-Z coordinates, and terms such as “adjacent” may be understoodby reference to the illustrated X-Y coordinates.

FIG. 1 a is a cross-section elevation of an apparatus 100 for aprocessor with an embedded microelectronic die according to an exampleembodiment. The apparatus 100 includes a processor mounting substrate100 includes a die side 112 to accept a processor, and a land side 114for coupling to outside communication such as a board. The mountingsubstrate 110 includes a processor footprint 116 on the die side 112.The processor footprint 116 may be ascertained in subsequent drawingsdisclosed herein by projecting illustrated processors on respective diesides of illustrated mounting substrates. Throughout this disclosure,the processor mounting substrate may also be referred to as a package,whether there is a processor mounted on the processor footprint or theprocessor footprint is not occupied.

In an embodiment, a microelectronic die 118 is embedded in the mountingsubstrate 110. The microelectronic die 118 is coupled to at least oneprocessor interconnect 120 that is upon the die side 112 or at leastcoupled to an interconnect that will be coupled with a processor. In anembodiment, the microelectronic die 118 is embedded at least partiallyin a core 122 section of the mounting substrate 110. In an embodiment,the microelectronic die 118 is embedded at least partially in a die-sidebuild-up 124 section of the mounting substrate 110. In an embodiment,the microelectronic die 118 is embedded at least partially in aland-side build-up 126 section of the mounting substrate 110. Otherstructures are seen in this cross section elevation including athrough-substrate via 128 according to an embodiment. Communication tothe mounting substrate 110 is also made useful with die-side contacts,one of which is depicted with reference numeral 130, and with land-sidecontacts, one of which is depicted with reference numeral 132.

It can be seen that the microelectronic die 118 has a characteristicdimension that is smaller than the processor footprint 116. In anembodiment, the microelectronic die is disposed entirely within theprocessor footprint 116 as illustrated in FIG. 1 a.

In an embodiment, the microelectronic die 118 is a memory die such as arandom-access memory (RAM) die 118. In an embodiment, themicroelectronic die 118 is a memory die such as a dynamic random-accessmemory (DRAM) die 118. In an embodiment, the microelectronic die 118 isa memory die such as a static random-access memory (SRAM) die 118. In anembodiment, the microelectronic die 118 is a memory die such as aerasable programmable memory (EPROM) die 118. Other memory dieconfigurations may be used according to a specific application.

In an embodiment, the microelectronic die 118 includes a radio-frequencyidentification (RFID) tag. In an embodiment, the microelectronic die 118includes a radio-frequency transceiver for wireless communication.

FIG. 1 b is a cross-section elevation of an apparatus that includes themounting substrate for a processor depicted in FIG. 1 a after furtherprocessing according to an example embodiment. The mounting substrate110 has been coupled to a processor 134 that occupies the processorfootprint 116 (FIG. 1 a) by its presence. The mounting substrate 110 andthe processor 134 form an apparatus 101. In an embodiment, the processor134 is mounted as a flip-chip and communicates to the mounting substrate100 through a series of electrical bumps including the electrical bumpwith the reference numeral 136. Other configurations may be arrangedsuch as a wire-bonding processor or a stacked-chip apparatus thatoccupies the processor footprint 116.

The processor 134 is delineated by a symmetry line 102 to assist indescribing relative placement of the microelectronic die 118. Asillustrated, although the microelectronic die 118 is disposed entirelywithin the footprint made by the processor 134, the microelectronic die118 may be situated asymmetrically below the processor 134. In anembodiment, processor contacts at one region of the processor 134 may bebrought closer to die contacts of the microelectronic die 118 byrelatively placing the processor 134 and microelectronic die 118 eithersymmetrically or asymmetrically. For example, where the microelectronicdie 118 is a RAM die such as a level-two (L2) cache (where L0 and L1 arewithin the processor 134), a shortened physical signal path may beaccomplished by either placing the two dice out of symmetrically orasymmetrically along the symmetry line 102. Inductive effects may alsobe lessened if a shortened physical signal path may be accomplished byeither placing the two dice symmetrically or asymmetrically with respectto the symmetry line 102 according to an embodiment. It can also beunderstood that although the processor 134 is depicted in X-Zcross-section orientation, relative placement of the processor 134 andthe microelectronic die 118 may also be symmetrical or asymmetrical inthe Y orientation (into the plane of the FIG.) according to a givenapplication.

In an embodiment, placement of the microelectronic die 118 relative tothe symmetry line 102 of the processor 134 is calculated to avoidconcentration of hot spots between the two dice 118 and 134. In anembodiment, a processor hot spot 138 is depicted at the right of theprocessor 134 and a microelectronic die hot spot 140 is depicted at theleft of the microelectronic die 118. As illustrated, the two hot spots138 and 140 are located maximally apart from each other. During ordinaryuse of the apparatus 101 “heat soak” into the apparatus 101 is made moreeven by locating one hot spot 138 remotely from the other hot spot 140such as relatively symmetrically or asymmetrically.

In an embodiment, the processor 134 and the microelectronic die 118 arelocated symmetrically and the hot spots 138 and 140 are configured tomake a more uniform heat soak into the apparatus 101 during ordinaryusage. In an embodiment, the processor 134 and the microelectronic die118 are located asymmetrically and the hot spots 138 and 140 areconfigured to make a more uniform heat soak into the apparatus 101during ordinary usage. In an embodiment, the processor 134 and themicroelectronic die 118 are located symmetrically, the hot spots 138 and140 are configured to make a more uniform heat soak into the apparatus101 during ordinary usage, and a shortened physical signal path isaccomplished between the two dice 134 and 118 by the symmetricalplacement. In an embodiment, the processor 134 and the microelectronicdie 118 are located asymmetrically, the hot spots 138 and 140 areconfigured to make a more uniform heat soak into the apparatus 101during ordinary usage, and a shortened physical signal path isaccomplished between the two dice 134 and 118 by the symmetricalplacement.

In an example embodiment, I/O density within the microelectronic die 118is in a range between 128 bits per die (such as when the microelectronicdie 118 is a DRAM die) and 252 bits/die. In an example embodiment, I/Ospeed between the processor 134 and the microelectronic die 118 isbetween 10 Gb/s (giga bits) and 1 Tb/s (tera bits per second). Along a10 mm edge of the embedded microelectronic die 118 as a DRAM die, totalbandwidth is from 160 GB/s (giga bytes) to 320 GB/s. As a package, theapparatus 101 has a total package bandwidth between 640 GB/s to 6400GB/s according to an embodiment, where the processor 134 and themicroelectronic die 118 each may operate above 256 bits. The I/O speedmay run slower below 10 Gb/s (such as below 7 Gb/s) where a givenapplication may be useful at this range.

In an example method embodiment, I/O density was 128 bits for the die118 as a DRAM, the I/O speed was at 10 Gb/s, and the total bandwidth ofthe apparatus 101 was 160 GB/s. In an example method embodiment, I/Odensity was 256 bits for the die 118 as a DRAM, the I/O speed was at 100Gb/s, and the total bandwidth of the apparatus 101 was 6400 GB/s.

It can now be appreciated that both vertical (Z-dimension) and lateral(X-Y dimension) form factors are reduced according to the severalembodiments set forth relating to FIG. 1 as well as the followingdescribed and illustrated embodiments.

FIG. 2 is a cross-section elevation of an apparatus 201 including amounting substrate 210 for a processor 234 with an embeddedmicroelectronic die according to an example embodiment. The mountingsubstrate 210 includes a die side 212 to accept a processor, and a landside 214 for coupling to outside communication such as a board. Themounting substrate 210 includes a processor footprint on the die side212 that is entirely occupied by the processor 234.

In an embodiment, a microelectronic die 218 is embedded in the mountingsubstrate 210. The microelectronic die 218 is coupled to at least oneprocessor interconnect 220 that is upon the die side 212 or at leastcoupled to an interconnect that will be coupled with a processor. Asillustrated, the microelectronic die 218 is embedded at least partiallyin a die-side build-up 224 section of the mounting substrate 210according to an embodiment. In an embodiment, the microelectronic die218 may be embedded at least partially in a core structure 222. In anembodiment, the microelectronic die 218 may be embedded at leastpartially in a land-side build-up 226 section of the mounting substrate210. Other structures are seen in this cross section elevation includinga through-substrate via 128 according to an embodiment. Communication tothe mounting substrate 210 is also made useful with die-side contacts,one of which is depicted with reference numeral 230, and with land-sidecontacts, one of which is depicted with reference numeral 232.

It can be seen that the microelectronic die 218 has a characteristicdimension that is smaller than the space occupied by the processorfootprint. In an embodiment, the microelectronic die 218 is disposedentirely within the footprint occupied by the processor 234. In anembodiment, the microelectronic die 218 may be disposed below theprocessor 234, but it may have a footprint that is larger than thefootprint occupied by the processor 234.

Other structures are seen in this cross section elevation including athrough-substrate via 228 according to an embodiment. Communication tothe mounting substrate 210 is also made useful with die-side contacts,one of which is depicted with reference numeral 230, and with land-sidecontacts, one of which is depicted with reference numeral 232.

In an embodiment, the microelectronic die 218 is a memory die similarlyto any of the memory die embodiments described and illustrated in FIG. 1a. In an embodiment, the microelectronic die 218 includes an RFIG tag.In an embodiment, the microelectronic die 218 includes and RFtransceiver for wireless communication.

The processor 234 is delineated by a symmetry line 202 to assist indescribing relative placement of the microelectronic die 218. Asillustrated, although the microelectronic die 218 is disposed entirelywithin the footprint made by the processor 234, the microelectronic die218 may be situated asymmetrically below the processor 234. In anembodiment, processor contacts at one region of the processor 234 may bebrought closer to die contacts of the microelectronic die 218 byrelatively asymmetrically placing the processor 234 and microelectronicdie 218. For example, where the microelectronic die 218 is a RAM diesuch as a L2 cache (where L0 and L1 are within the processor 234), ashortened physical signal path may be accomplished by either placing thetwo dice symmetrically or asymmetrically along the symmetry line 202.Inductive effects may also be lessened if a shortened physical signalpath may be accomplished by either placing the two dice symmetrically,or asymmetrically with respect to the symmetry line 202 according to anembodiment. It can also be understood that although the processor 234 isdepicted in X-Z cross-section orientation, relative placement of theprocessor 234 and the microelectronic die 218 may also be symmetrical orasymmetrical in the Y orientation according to a given application.

It can now be appreciated that placement of the processor 234 and themicroelectronic die 218 relative to the symmetry line 202 of theprocessor, may include permutations of symmetrical or asymmetricalplacement, hot-spot location for uniform heat soak, and shortenedphysical signal path between the two dice 234 and 218 as more fullydisclosed relative to the apparatus 101 depicted in FIG. 1 a.

In an example embodiment, I/O density within the microelectronic die 218is in a range between 128 bits per die (such as when the microelectronicdie 218 is a DRAM die) and 252 bits/die. In an example embodiment, I/Ospeed between the processor 234 and the microelectronic die 218 isbetween 10 Gb/s and 1 Tb/s (tera bits per second). Along a 10 mm edge ofthe embedded microelectronic die 218 as a DRAM die, total bandwidth isfrom 160 GB/s to 320 GB/s. As a package, the apparatus 201 has a totalpackage bandwidth between 640 GB/s to 6400 GB/s according to anembodiment, where the processor 234 and the microelectronic die 218 eachmay operate at or above 256 bits. The I/O speed may run slower below 10Gb/s (such as below 7 Gb/s) where a given application may be useful atthis range.

In an example method embodiment, I/O density was 128 bits for the die218 as a DRAM, the I/O speed was at 10 Gb/s, and the total bandwidth ofthe apparatus 201 was 160 GB/s. In an example method embodiment, I/Odensity was 256 bits for the die 218 as a DRAM, the I/O speed was at 100Gb/s, and the total bandwidth of the apparatus 201 was 6400 GB/s.

FIG. 3 is a cross-section elevation of an apparatus 301 including amounting substrate 310 for a processor 334 with at least one embeddedmicroelectronic die according to an example embodiment. The mountingsubstrate 310 includes a die side 312 to accept a processor 334, and aland side 314 for coupling to outside communication such as a board. Themounting substrate 310 includes a processor footprint on the die side312 that is entirely occupied by the processor 334.

In an embodiment, a first microelectronic die 318 is embedded in themounting substrate 310. The first microelectronic die 318 is coupled toat least one processor interconnect 320 that is upon the die side 312 orat least coupled to an interconnect that will be coupled with aprocessor. In an embodiment, the first microelectronic die 318 may beembedded at least partially in a die-side build-up 324 section of themounting substrate 310. As illustrated, the first microelectronic die318 is embedded at least partially in a core structure 322. In anembodiment, the first microelectronic die 318 may be embedded at leastpartially in a land-side build-up 326 section of the mounting substrate310.

A second microelectronic die 319 is also depicted embedded in themounting substrate 310. The first microelectronic die 318 and the secondmicroelectronic die 319 are spaced apart below (Z-dimension) theprocessor footprint, which is entirely occupied by the processor 334.The second microelectronic die 319 is coupled to at least one processorinterconnect 321 that is upon the die side 312. In an embodiment, thesecond microelectronic die 319 is embedded at least partially in adie-side build-up 324 section of the mounting substrate 310. Asillustrated, the second microelectronic die 319 is embedded at leastpartially in the core structure 322. In an embodiment, the secondmicroelectronic die 318 may be embedded at least partially in aland-side build-up 326 section of the mounting substrate 310.

Other structures are seen in this cross section elevation including athrough-substrate via 328 according to an embodiment. Communication tothe mounting substrate 310 is also made useful with die-side bumps, oneof which is depicted with reference numeral 330, and with land-sidecontacts, one of which is depicted with reference numeral 332.

It can be seen that the first microelectronic die 318 is disposedpartially within the footprint of the processor 334. The secondmicroelectronic die 319 is also disposed partially within the footprintof the processor 334. In an embodiment, the first microelectronic die318 is a memory die according to any of the memory die embodiments setforth in this disclosure. In an embodiment, the second microelectronicdie 319 is a memory die according to any of the memory die embodimentsset forth in this disclosure. In an embodiment, the firstmicroelectronic die 318 and the second microelectronic die 319 are eacha memory die. In an embodiment, the first memory die 318 is a firstmemory cache that is accessed more frequently by the processor 334 thanthe second memory die 319 that is a second memory cache.

In an embodiment, the first microelectronic die 318 is a memory die 318and the structure 319 is an embedded RF transceiver 319. Althoughstructure 318 and structure 319 are depicted as approximately equal incross-sectional size, they may be of different relative sizes. Forexample, structure 318 may be sized and placed as seen, but structure319 may be sized smaller in the Z-dimension and placed entirely withinthe die-side build-up 324 section of the mounting substrate 310.

In an embodiment, one of the first microelectronic die 318 or the secondmicroelectronic die 319 includes an RFIG tag. In an embodiment, one ofthe first microelectronic die 318 or the second microelectronic die 319includes and RF transceiver for wireless communication.

A symmetry line 302 for the processor 334 may be used to defineplacement of the first microelectronic die 318 and the secondmicroelectronic die 319. As illustrated, a processor hot spot 338, afirst die hot spot 340, and a second die hot spot 342 may be spacedapart to allow a more uniform heat soak into the apparatus 301. Relativedie placement may be done to improve electrical path length. It may alsobe done to reduce inductive effects. It may also be done for anycombination of these improvements.

In an example embodiment, I/O density within either of the firstmicroelectronic die 318 and the second microelectronic die 319 is in arange between 128 bits/die and 252 bits/die. In an example embodiment,I/O speed between the processor 334 and the first microelectronic die318 is between 10 Gb/s and 1 Tb/s (tera bits per second). Along a 10 mmedge of either the embedded microelectronic die 318 or 319 as DRAM dice,total bandwidth is from 160 GB/s (giga bytes per second) to 320 GB/s. Asa package, the apparatus 301 has a total package bandwidth between 640GB/s to 6400 GB/s according to an embodiment, where the processor 334and each microelectronic die 318 or 319 each may operate at or above 256bits. The I/O speed may run slower below 10 Gb/s (such as below 7 Gb/s)where a given application may be useful at this range.

In an embodiment, communication between the first die 318 (a DRAM die)and the second die 319 runs at an I/O speed between 10 Gb/s and 1 Tb/s.

In an example method embodiment, I/O density was 128 bits for the firstdie 318 as a DRAM, the I/O speed was at 10 Gb/s, and the total bandwidthof the apparatus 301 was 160 GB/s. In an example method embodiment, I/Odensity was 256 bits for the first die 318 as a DRAM, the I/O speed wasat 100 Gb/s, and the total bandwidth of the apparatus 301 was 6400 GB/s.

FIG. 4 is a cross-section elevation of an apparatus 401 including amounting substrate 410 for a processor 434 with at least one embeddeddie according to an example embodiment. The mounting substrate 410includes a die side 412 to accept the processor 434, and a land side 414for coupling to outside communication such as a board. The mountingsubstrate 410 includes a processor footprint on the die side 412 that isentirely occupied by the processor 434.

In an embodiment, a first microelectronic die 418 is embedded in themounting substrate 410. The first microelectronic die 418 is coupled toat least one processor interconnect 420 that is upon the die side 412 orat least coupled to an interconnect that will be coupled with aprocessor. In an embodiment, the first microelectronic die 418 may beembedded at least partially in a die-side build-up 424 section of themounting substrate 410. As illustrated, the first microelectronic die418 is embedded at least partially in the die-side build-up 424 sectionof the mounting substrate 410. A second microelectronic die 419 isdisposed below an in contact with the first microelectronic die 418. Inan embodiment, a third microelectronic die 444 is disposed below and incontact with the second microelectronic die 419. In an embodiment, asubsequent microelectronic die 446 is disposed below the firstmicroelectronic die 418. As illustrated, the subsequent microelectronicdie 446 is disposed below and in contact with the third microelectronicdie 444.

Other structures are seen in this cross section elevation including athrough-substrate via 428 according to an embodiment. Communication tothe mounting substrate 410 is also made useful with die-side bumps, oneof which is depicted with reference numeral 430, and with land-sidecontacts, one of which is depicted with reference numeral 432.

It can be seen that the first microelectronic die 418 is disposedentirely within the footprint of the processor 434. The secondmicroelectronic die 419 is also disposed partially within the footprintof the processor 434 as well as the third microelectronic die 444 andthe subsequent microelectronic die 446. In an embodiment, the firstmicroelectronic die 418 is a memory die according to any of the memorydie embodiments set forth in this disclosure. In an embodiment, thesecond microelectronic die 419 is a memory die according to any of thememory die embodiments set forth in this disclosure. In an embodiment,the third microelectronic die 444 is a memory die according to any ofthe memory die embodiments set forth in this disclosure. In anembodiment, the subsequent microelectronic die 446 is a memory dieaccording to any of the memory die embodiments set forth in thisdisclosure.

In an embodiment, each of the microelectronic dice 418, 419, 444, and446 is a memory die. In an embodiment, the first memory die 418 is afirst memory cache that is accessed more frequently by the processor 434than the any of the second, third, or subsequent memory dice.

In an embodiment, one of the microelectronic dice 418, 419, 444, or 446includes an RFIG tag. In an embodiment, one of the microelectronic dicemicroelectronic dice 418, 419, 444, or 446 includes and RF transceiverfor wireless communication.

A symmetry line 402 for the processor 434 may be used to defineplacement of any for the microelectronic dice.

In an example embodiment, I/O density within either of the firstmicroelectronic die 418 and the subsequent microelectronic die 319 is ina range between 128 bits/die and 252 bits/die. In an example embodiment,I/O speed between the processor 434 and the first microelectronic die418 is between 10 Gb/s and 1 Tb/s. Along a 10 mm edge of any of theembedded microelectronic dice 418 419, 444, or 446 as DRAM dice, totalbandwidth is from 160 GB/s to 320 GB/s. As a package, the apparatus 401has a total package bandwidth between 640 GB/s to 6400 GB/s according toan embodiment, where the processor 434 and any of the microelectronicdice 418, 419, 444, or 446 each may operate at or above 256 bits. TheI/O speed may run slower below 10 Gb/s (such as below 7 Gb/s) where agiven application may be useful at this range.

In an embodiment, communication between the first die 418 (a DRAM die)and the subsequent die 446 runs at an I/O speed between between 10 Gb/sand 1 Tb/s.

In an example method embodiment, I/O density was 128 bits for the firstdie 418 as a DRAM, the I/O speed was at 10 Gb/s, and the total bandwidthof the apparatus 401 was 160 GB/s. In an example method embodiment, I/Odensity was 256 bits for the first die 418 as a DRAM, the I/O speed wasat 100 Gb/s, and the total bandwidth of the apparatus 401 was 6400 GB/s.

FIG. 5 is a cross-section elevation of an apparatus 501 including amounting substrate 510 for a processor 534 with at least one embeddeddie according to an example embodiment. The mounting substrate 510includes a die side 512 to accept a processor 534, and a land side 514for coupling to outside communication such as a board. The mountingsubstrate 510 includes a processor footprint on the die side 512 that isentirely occupied by the processor 534.

In an embodiment, a first microelectronic die 518 is embedded in themounting substrate 510. The first microelectronic die 518 is coupled toat least one processor interconnect 520 that is upon the die side 512 orat least coupled to an interconnect that will be coupled with aprocessor. The first microelectronic die 518 also has at least onethrough-silicon via (TSV) structure such that the die 518 is alsocoupled to at least one interconnect 560 that is upon the land side 514or at least coupled to an interconnect that will be coupled with adevice that is to be accessed through the land side 514. It will now beclear that the first microelectronic die 518 may have the active surfacefacing toward the land side 514, that the second microelectronic die 519may have the active surface facing toward the land side 514, or thatboth dice 518 and 519 have the active surface facing toward the landside 514.

In an embodiment, the first microelectronic die 518 may be embedded atleast partially in a die-side build-up 524 section of the mountingsubstrate 510. As illustrated, the first microelectronic die 518 isembedded at least partially in a core structure 522. In an embodiment,the first microelectronic die 518 may be embedded at least partially ina land-side build-up 526 section of the mounting substrate 510.

The second microelectronic die 519 is also depicted embedded in themounting substrate 510. The second microelectronic die 519 is coupled toat least one processor interconnect 521 that is upon the die side 512.The second microelectronic die 519 also has at least one TSV structuresuch that the die 519 is also coupled to at least one interconnect 561that is upon the land side 514 or at least coupled to an interconnectthat will be coupled with a device that is to be accessed through theland side 514.

In an embodiment, the second microelectronic die 519 is embedded atleast partially in the die-side build-up 524 section of the mountingsubstrate 510. As illustrated, the second microelectronic die 519 isembedded at least partially in the core structure 522. In an embodiment,the second microelectronic die 519 may be embedded at least partially ina land-side build-up 526 section of the mounting substrate 510.

Other structures are seen in this cross section elevation including athrough-substrate via 528 according to an embodiment. Communication tothe mounting substrate 510 is also made useful with die-side bumps, oneof which is depicted with reference numeral 530, and with land-sidecontacts, one of which is depicted with reference numeral 532.

It can be seen that the first microelectronic die 518 is disposedpartially within the footprint of the processor 534. The secondmicroelectronic die 519 is also disposed partially within the footprintof the processor 534. In an embodiment, the first microelectronic die518 is a memory die according to any of the memory die embodiments setforth in this disclosure. In an embodiment, the second microelectronicdie 519 is a memory die according to any of the memory die embodimentsset forth in this disclosure. In an embodiment, the firstmicroelectronic die 518 and the second microelectronic die 519 are eacha memory die. In an embodiment, the first memory die 518 is a firstmemory cache that is accessed more frequently by the processor 534 thanthe second memory die 519 that is a second memory cache.

In an embodiment, one of the first microelectronic die 518 or the secondmicroelectronic die 519 includes an RFIG tag. In an embodiment, one ofthe first microelectronic die 518 or the second microelectronic die 519includes and RF transceiver for wireless communication. Placement of thefirst microelectronic die 518 and the second microelectronic die 519relative to the processor 534 may be done to facilitate heat-soakmanagement according to any of the disclosed embodiments. Relative dieplacement may be done to improve electrical path length. It may also bedone to reduce inductive effects. It may also be done for anycombination of these improvements.

In an example method embodiment, I/O density is 256 bits for the firstdie 518 as a DRAM, the I/O speed is at 10 Gb/s, and the total bandwidthof the apparatus 501 is 640 GB/s. In an example method embodiment, I/Odensity is 512 bits for the first die 518 as a DRAM, the I/O speed is at100 Gb/s, and the total bandwidth of the apparatus 501 is 6400 GB/s.

FIG. 6 is a cross-section elevation of an apparatus 601 including amounting substrate 610 for a processor 634 with at least one embeddeddie according to an example embodiment. The mounting substrate 610includes a die side 612 to accept a processor 634, and a land side 614for coupling to outside communication such as a board. The mountingsubstrate 610 includes a processor footprint on the die side 612 that isentirely occupied by the processor 634.

The processor 634 is a wire-bond device. The processor 634 iselectrically coupled the to other devices by a plurality of bond wires,one of which is indicated with reference numeral 662, and one of whichis indicated with reference numeral 663.

In an embodiment, a first microelectronic die 618 is embedded in themounting substrate 610. The first microelectronic die 618 is coupledthrough a first bond wire 662 to at least one processor interconnect 620that is near the die side 612 or at least coupled to an interconnectthat will be coupled with a processor. In an embodiment, the firstmicroelectronic die 618 also has at least one TSV structure such thatthe die 618 is also coupled to at least one interconnect 660 that isnear the land side 614 or at least coupled to an interconnect that willbe coupled with a device that is to be accessed through the land side614. It will now be clear that the first microelectronic die 618 mayhave the active surface facing toward the land side 614, that the secondmicroelectronic die 619 may have the active surface facing toward theland side 614, or that both dice 618 and 619 have the active surfacefacing toward the land side 614.

In an embodiment, the first microelectronic die 618 may be embedded atleast partially in a die-side build-up 624 section of the mountingsubstrate 610. As illustrated, the first microelectronic die 618 isembedded at least partially in a core structure 622. In an embodiment,the first microelectronic die 618 may be embedded at least partially ina land-side build-up 626 section of the mounting substrate 610.

The second microelectronic die 619 is also depicted embedded in themounting substrate 610. The second microelectronic die 619 is coupledthrough the second bond wire 663 to at least one processor interconnect621 that is upon the die side 612. In an embodiment, the secondmicroelectronic die 619 also has at least one TSV structure such thatthe die 619 is also coupled to at least one interconnect 661 that isnear the land side 614 or at least coupled to an interconnect that willbe coupled with a device that is to be accessed through the land side614.

In an embodiment, the second microelectronic die 619 is embedded atleast partially in the die-side build-up 624 section of the mountingsubstrate 610. As illustrated, the second microelectronic die 619 isembedded at least partially in the core structure 622. In an embodiment,the second microelectronic die 619 may be embedded at least partially ina land-side build-up 626 section of the mounting substrate 510.

Other structures are seen in this cross section elevation including athrough-substrate via 628 according to an embodiment. Communication tothe mounting substrate 610 is also made useful land-side contacts, oneof which is depicted with reference numeral 632.

It can be seen that the first microelectronic die 618 is disposedentirely outside the footprint of the processor 634. The secondmicroelectronic die 619 is also disposed entirely outside the footprintof the processor 634. In an embodiment, the first microelectronic die618 is a memory die according to any of the memory die embodiments setforth in this disclosure. In an embodiment, the second microelectronicdie 619 is a memory die according to any of the memory die embodimentsset forth in this disclosure. In an embodiment, the firstmicroelectronic die 618 and the second microelectronic die 619 are eacha memory die. In an embodiment, the first memory die 618 is a firstmemory cache that is accessed more frequently by the processor 634 thanthe second memory die 619 that is a second memory cache.

In an embodiment, one of the first microelectronic die 618 or the secondmicroelectronic die 619 includes an RFIG tag. In an embodiment, one ofthe first microelectronic die 618 or the second microelectronic die 619includes and RF transceiver for wireless communication. Placement of thefirst microelectronic die 618 and the second microelectronic die 619relative to the processor 534 may be done to facilitate heat-soakmanagement according to any of the disclosed embodiments. Relative dieplacement may be done to improve electrical path length. It may also bedone to reduce inductive effects. It may also be done for anycombination of these improvements.

In an example method embodiment, I/O density is 256 bits for the firstdie 618 as a DRAM, the I/O speed is at 10 Gb/s, and the total bandwidthof the apparatus 601 is 640 GB/s. In an example method embodiment, I/Odensity is 512 bits for the first die 618 as a DRAM, the I/O speed is at100 Gb/s, and the total bandwidth of the apparatus 601 is 6400 GB/s.

FIG. 7 is a process and method flow diagram 700 according to an exampleembodiment.

At 710, a process includes embedding a first microelectronic die in aprocessor mounting substrate. It is now clear that the process ofembedding such a die may be done in the substrate core (unless it iscoreless) according to disclosed embodiments. In an embodiment, thesubstrate die-side build-up according to disclosed embodiments. In anembodiment, the substrate land-side build-up according to disclosedembodiments, or in a combination of at least two according to disclosedembodiments.

At 712, the process includes embedding a second microelectronic die inthe processor mounting substrate. It is now clear that the process ofembedding a second die may be done in the substrate core (unless it iscoreless) according to disclosed embodiments, in the substrate die-sidebuild-up according to disclosed embodiments, in the substrate land-sidebuild-up according to disclosed embodiments, or in a combination of atleast two according to disclosed embodiments.

At 718, the process is represented as at least a third-die-embeddingprocess, or embedding a subsequent microelectronic die in the processormounting substrate. It is now clear that the process of embedding asubsequent die may be done in the substrate core (unless it is coreless)according to disclosed embodiments, in the substrate die-side build-upaccording to disclosed embodiments, in the substrate land-side build-upaccording to disclosed embodiments, or in a combination of at least twoaccording to disclosed embodiments.

In an embodiment, the process commences at 710 and terminates at one of712, or 718.

At 720, the process includes coupling the microelectronic die (includingthe first and optionally the second and subsequent dice) to a processorthat is mounted on the processor mounting substrate. In an embodiment,the process commences and terminates at 720.

At 730, a method embodiment includes accessing the first microelectronicdie from the processor. In an embodiment, the accessing method is amemory-access action taken by the processor. In an embodiment, themethod commences at 720 and terminates at 730.

In an embodiment, accessing the first microelectronic die from theprocessor is done at a rate from 10 gigabits (Gb) per second to 1 Tb/s.This rate is higher than conventional access rates between a processorand a surface-mounted microelectronic die.

At 732, a method embodiment includes accessing the secondmicroelectronic die from the processor. In an embodiment, the processcommences and terminates at 732. In an embodiment, accessing the secondmicroelectronic die from the processor is done simultaneously withaccessing the first microelectronic die. In an embodiment, thissimultaneously accessing is carried out where the first and second diceare memory dies and an accessing command is sent to each of the first-and second memory dies. The accessing command to the first memory die isnot completely responded before the accessing command to the secondmemory die is completed. In an embodiment, accessing the firstmicroelectronic die from the processor is done at a rate from 10 Gb/s to1 Tb/s, and accessing the second microelectronic die from the processoris done at a rate from 10 Gb/s to 1 Tb/s.

In an embodiment, the method commences at 720 and terminates at 732. Itshould now be clear the method of accessing the second microelectronicdie from the processor may also mean accessing a third, hence subsequentmicroelectronic die from the processor such as in a memory access actiontaken by the processor.

At 738, the method includes accessing a subsequent microelectronic diefrom the first microelectronic die. In an embodiment, the methodcommences at 720 and terminates at 738. In an embodiment, the processcommences and terminates at 738. It should now be clear the method ofaccessing the subsequent microelectronic die from the firstmicroelectronic die may mean any subsequent microelectronic die isaccessed by another microelectronic die. This means the othermicroelectronic die is “closer” in access sequence to the processor thanthe subsequent microelectronic die. In an embodiment, accessing thesubsequent microelectronic die from the first microelectronic die isdone at a rate from 10 Gb/s to 1 Tb/s, and accessing the secondmicroelectronic die from the processor is done at a rate from 10 Gb/s to1 Tb/s.

FIG. 8 is a schematic of a computer system according to an embodiment.

The computer system 800 (also referred to as the electronic system 800)as depicted can embody a microelectronic die embedded in a processormounting substrate according to any of the several disclosed embodimentsand their equivalents as set forth in this disclosure. In an embodiment,the electronic system 800 is a computer system that includes a systembus 820 to electrically couple the various components of the electronicsystem 800. The system bus 820 is a single bus or any combination ofbusses according to various embodiments. The electronic system 800includes a voltage source 830 that provides power to the integratedcircuit 810. In some embodiments, the voltage source 830 suppliescurrent to the integrated circuit 810 through the system bus 820.

The integrated circuit 810 is electrically coupled to the system bus 820and includes any circuit, or combination of circuits according to anembodiment. In an embodiment, the integrated circuit 810 includes aprocessor 812 that can be of any type. As used herein, the processor 812may mean any type of circuit such as, but not limited to, amicroprocessor, a microcontroller, a graphics processor, a digitalsignal processor, or another processor. In an embodiment, SRAMembodiments are found in memory caches of the processor. Other types ofcircuits that can be included in the integrated circuit 810 are a customcircuit or an application-specific integrated circuit (ASIC), such as acommunications circuit 814 for use in wireless devices such as cellulartelephones, pagers, portable computers, two-way radios, and similarelectronic systems. In an embodiment, the processor 810 includes on-diememory 816 such as static random-access memory (SRAM) and the SRAM mayinclude a 6T SRAM cell with independent S/D sections of the access andpull-down regions. In an embodiment, the processor 810 includes embeddedon-die memory 816 such as embedded dynamic random-access memory (eDRAM).

In an embodiment, the electronic system 800 also includes an externalmemory 840 that in turn may include one or more memory elements suitableto the particular application, such as a main memory 842 in the form ofRAM, one or more hard drives 844, and/or one or more drives that handleremovable media 846, such as diskettes, compact disks (CDs), digitalvariable disks (DVDs), flash memory drives, and other removable mediaknown in the art. The external memory 840 may also be embedded memory848 such as the microelectronic die embedded in a processor mountingsubstrate according to an embodiment.

In an embodiment, the electronic system 800 also includes a displaydevice 850, an audio output 860. In an embodiment, the electronic system800 includes an input device such as a controller 870 that may be akeyboard, mouse, trackball, game controller, microphone,voice-recognition device, or any other input device that inputsinformation into the electronic system 800.

As shown herein, the integrated circuit 810 can be implemented in anumber of different embodiments, including a microelectronic dieembedded in a processor mounting substrate according to any of theseveral disclosed embodiments and their equivalents, an electronicsystem, a computer system, one or more methods of fabricating anintegrated circuit, and one or more methods of fabricating an electronicassembly that includes a microelectronic die embedded in a processormounting substrate according to any of the several disclosed embodimentsas set forth herein in the various embodiments and their art-recognizedequivalents. The elements, materials, geometries, dimensions, andsequence of operations can all be varied to suit particular I/O couplingrequirements including array contact count, array contact configurationfor a microelectronic die embedded in a processor mounting substrateaccording to any of the several disclosed embodiments and theirequivalents.

The Abstract is provided to comply with 37 C.F.R. §1.72(b) requiring anabstract that will allow the reader to quickly ascertain the nature andgist of the technical disclosure. It is submitted with the understandingthat it will not be used to interpret or limit the scope or meaning ofthe claims.

In the foregoing Detailed Description, various features are groupedtogether in a single embodiment for the purpose of streamlining thedisclosure. This method of disclosure is not to be interpreted asreflecting an intention that the claimed embodiments of the inventionrequire more features than are expressly recited in each claim. Rather,as the following claims reflect, inventive subject matter lies in lessthan all features of a single disclosed embodiment. Thus the followingclaims are hereby incorporated into the Detailed Description, with eachclaim standing on its own as a separate preferred embodiment.

It will be readily understood to those skilled in the art that variousother changes in the details, material, and arrangements of the partsand method stages which have been described and illustrated in order toexplain the nature of this invention may be made without departing fromthe principles and scope of the invention as expressed in the subjoinedclaims.

1. An apparatus comprising: a mounting substrate for a processor,wherein the mounting substrate includes a die side and a land side; aprocessor footprint configured on the mounting substrate die side,wherein the processor footprint is coupled to at least one processorinterconnect; a microelectonic die embedded in the mounting substrate,wherein the microelectronic die is coupled to the at least one processorinterconnect, wherein the mounting substrate includes a core and abuild-up layer, wherein the microelectronic die is a first memory die,the apparatus further including; a subsequent microelectronic die,wherein the subsequent microelectronic die is also embedded in themounting substrate, wherein the first memory die and the subsequentmicroelectronic die are vertically stacked, and wherein the subsequentmicroelectronic die is at least partially embedded in the build-uplayer.
 2. An apparatus comprising: a mounting substrate for a processor,wherein the mounting substrate includes a die side and a land side; aprocessor footprint configured on the mounting substrate die side,wherein the processor footprint is coupled to at least one processorinterconnect; a microelectonic die embedded in the mounting substrate,wherein the microelectronic die is coupled to the at least one processorinterconnect, wherein the mounting substrate includes a core and abuild-up layer, wherein the mounting substrate includes a core and abuild-up layer, wherein the microelectronic die is a first memory die,the apparatus further including; a subsequent memory die, wherein thesubsequent memory die is also embedded in the mounting substrate,wherein the first memory die and the subsequent memory die arevertically stacked, and wherein the subsequent memory die is at leastpartially embedded in the build-up layer.